FCCL
What is FCCL?
FCCL(¿¬¼ºµ¿¹ÚÀûÃþü)Àº FPCB(Flexible Printed Circuit Boards, ¿¬¼ºÈ¸·Î±âÆÇ)ÀÇ ÇÙ½É Àç·á·Î¼, ²ªÀÓÀ̳ª ¹Ýº¹ÀûÀÎ ±¼°îÀÌ ÇÊ¿äÇÑ ºÎÀ§¿¡ ÁÖ·Î Àû¿ëµË´Ï´Ù. ÇÏÁö¸¸ ÃÖ±Ù¿¡´Â ¸ð¹ÙÀϱâ±âÀÇ °æ¹Ú´Ü¼ÒÈ¿¡ µû¶ó Àû¿ë ºÎÀ§°¡ Á¡Â÷ È®´ëµÇ°í ÀÖ´Â Ãß¼¼·Î, ½º¸¶Æ®ÆùÀ» Æ÷ÇÔÇÑ ¸ð¹ÙÀÏÆù, Å×ºí¸´PC, µðÁöÅÐ Ä«¸Þ¶ó, HDD, ±¤Pick-up, µð½ºÇ÷¹ÀÌ µî ´Ù¾çÇÑ ÀüÀÚ±â±â¿¡ »ç¿ëµÇ°í ÀÖ½À´Ï´Ù.
FCCLÀº Àü±âÀüµµÃ¼·Î »ç¿ëµÇ´Â µ¿¹Ú°ú Àý¿¬Ã¼·Î »ç¿ëµÇ´Â PolyimideÀÇ ÀûÃþ ÇüÅ·Π±¸¼ºµÇ¾î ÀÖÀ¸¸ç, µ¿¹ÚÀÌ ÇÑÂʸ鿡¸¸ Á¸ÀçÇÏ´Â ´Ü¸éFCCL(Single Side FCCL)°ú ¾çÂʸ鿡 Á¸ÀçÇÏ´Â ¾ç¸éFCCL(Double Side FCCL)·Î ±¸ºÐÇÒ ¼ö ÀÖ½À´Ï´Ù.
FPCB Á¦Á¶°øÁ¤Àº µå¸±, µ¿µµ±Ý, ³ë±¤, Çö»ó(Development), ¿¡Äª(Etching), ¹Ú¸®, °í¿Â Press, ±Ýµµ±Ý, Soldering µî ¸¹Àº ´Ü°è·Î ÀÌ·ç¾îÁ® ÀÖ½À´Ï´Ù. µû¶ó¼, FCCLÀº »êÀ̳ª ¿°±â µî ´Ù¾çÇÑ ¾àǰ ¹× °í¿Â/°í½À¿¡ °ßµô ¼ö ÀÖ´Â ³»ÈÇмº°ú Èí½À³»¿¼ºÀÌ ¿ì¼öÇØ¾ß Çϸç, ¿Âµµ º¯È¿¡ µû¸¥ Ä¡¼ö º¯È°¡ Àû¾î¾ß Çϰí(Ä¡¼ö¾ÈÁ¤¼º), µ¿¹Ú°ú Polyimide°£ Á¢Âø·ÂÀÌ ¿ì¼öÇÏ¿©¾ß ÇÕ´Ï´Ù. ±× ¿Ü¿¡µµ ±¼°î¼º, PolyimideÀÇ Àü±âÀû Ư¼º, ±â°èÀû Ư¼º µîÀÌ ÁÖ¿ä ¹°¼º¿¡ ÇØ´çÇÕ´Ï´Ù.
SKI's FCCL
Enflex®´Â SKÀ̳뺣À̼ǿ¡¼ °³¹ßÇÏ¿© »ý»êÇϰí ÀÖ´Â FCCLÀÇ °íÀ¯ ºê·£µåÀÔ´Ï´Ù. SKÀ̳뺣À̼ÇÀº µ¶ÀÚÀûÀÎ Polyimide ±â¼úÀ» ¿Ï¼ºÇßÀ» »Ó ¾Æ´Ï¶ó, ÄÚÆÃ, °æÈ, Ç¥¸éó¸®, °í¿Â Laminating µî ´Ù¾çÇÑ °øÁ¤¿¡¼ ¼ö ³â°£ ÃàÀûÇÑ ±â¼úÀ» Ȱ¿ëÇÏ¿© ¿ì¼öÇÑ ¹°¼ºÀÇ FCCLÀ» »ý»êÇϰí ÀÖ½À´Ï´Ù.
Enflex®ÀÇ Æ¯¼º
- °í°´ÀÇ Needs¿¡ À¯¿¬ÇÑ Polyimide ¼³°è ±â¼ú
- ¿ì¼öÇÑ Ä¡¼ö¾ÈÁ¤¼º
- ³·Àº ¼öºÐ Èí¼öÀ²
- ¶Ù¾î³ ³»¿¼º
- ¿ì¼öÇÑ ³»ÈÇмº
- ¶Ù¾î³ ±¼°î¼º
- ¿ì¼öÇÑ Àο°µµ ¹× ±â°èÀû Ư¼º
±¸ºÐ | Single Sided | Double Sided |
---|---|---|
Etching MD | 0.018% | 0.028% |
Etching TD | 0.012% | -0.005% |
Heating MD | -0.012% | 0.019% |
Heating TD | -0.015% | -0.014% |
What's Next?
SKÀ̳뺣À̼ÇÀº ÇöÀç »ý»êµÇ°í ÀÖ´Â FCCLÀÇ µÎ²² ¹üÀ§¸¦ ´õ¿í ´Ù¾çÇÏ°Ô È®ÀåÇÏ¿© °í°´ÀÇ »õ·Î¿î Needs¿¡ ´ëÀÀÇϰíÀÚ ÇÕ´Ï´Ù. ±×¸®°í, PolyimideÀÇ ±¤ÇРƯ¼º, Àü±âÀû Ư¼º, ±â°èÀû Ư¼ºÀ» UpgradeÇÏ¿© ¹Ì·¡ ½ÃÀåÀ» °³Ã´ÇÒ Áغñ¸¦ Çϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ FCCL »Ó¸¸ ¾Æ´Ï¶ó ´Ù¾çÇÑ È¸·Î±âÆÇ ¼ÒÀ縦 °³¹ßÇÏ¿©, °í°´°ú ÇÔ²²ÇÏ´Â Á¾ÇÕ È¸·Î±âÆÇ Solution Partner°¡ µÇ°íÀÚ ÇÕ´Ï´Ù.